A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package. - Mu-Shan Lin; Chien-Chun Tsai; Kenny Cheng-Hsiang Hsieh; Wen-Hung Huang; Yu-Chi Chen; Shu-Chun Yang; Chin-Ming Fu; Hao-Jie Zhan; Jinn-Yeh Chien; Shao-Yu Li; Y.-H. Chen; C.-C. Kuo; et al. (Hot Chips Symposium, 2016)