Thermal-Aware Fixed-Outline Floorplanning Using Analytical Models With Thermal-Force Modulation. - Jai-Ming Lin; Tai-Ting Chen; Hao-Yuan Hsieh; Ya-Ting Shyu; Yeong-Jar Chang; Juin-Ming Lu (IEEE Trans. Very Large Scale Integr. Syst., 2021)

Thermal-Aware Floorplanning and TSV-Planning for Mixed-Type Modules in a Fixed-Outline 3-D IC. - Jai-Ming Lin; Wei-Yi Chang; Hao-Yuan Hsieh; Ya-Ting Shyu; Yeong-Jar Chang; Juin-Ming Lu (IEEE Trans. Very Large Scale Integr. Syst., 2021)

Routability-Driven Analytical Placement with Precise Penalty Models for Large-Scale 3D ICs. - Jai-Ming Lin; Hao-Yuan Hsieh; Hsuan Kung; Hao-Jia Lin (ICCAD, 2022)