Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes. - Yang Liu 103; Fenglian Sun; Hao Zhang 034; Tong Xin; Cadmus A. Yuan; Guoqi Zhang (Microelectron. Reliab., 2015)

A new hermetic sealing method for ceramic package using nanosilver sintering technology. - Hao Zhang 034; Yang Liu 103; Lingen Wang; Jiajie Fan; Xuejun Fan; Fenglian Sun; Guoqi Zhang (Microelectron. Reliab., 2018)