Modeling and characterization of molding compound properties during cure. - Kaspar M. B. Jansen; C. Qian; Leo J. Ernst; C. Bohm; A. Kessler; Harald Preu; Matthias Stecher (Microelectron. Reliab., 2009)

A study on electrochemical effects in external capacitor packages. - Harald Preu; Jochen Feilmeier; Markus Lang; Norbert Soellner; Jürgen Walter; Walter Mack (Microelectron. Reliab., 2014)