Study of Thermomechanical Damage Mechanism in Al Interconnects in Al-SiO2 structure by High Density Peak Current. - Hariram Mohanram; Harikrishnan Kumarasamy; Choong-Un Kim; Young-Joon Park; Srikanth Krishnan (IRPS, 2024)

Thermomechanical Fatigue in Two Level Cu Interconnects Under Pulsing Peak Current. - Hariram Mohanram; Harikrishnan Kumarasamy; Choong-Un Kim; Young-Joon Park; Sudarshan Prasad; Srikanth Krishnan (IRPS, 2025)