Interconnect design tradeoffs for silicon and glass interposers. - Harry Kalargaris; Vasilis F. Pavlidis (NEWCAS, 2014)

Computationally efficient standard-cell FEM-based thermal analysis. - Yi-Chung Chen; Scott Ladenheim; Harry Kalargaris; Milan Mihajlovic; Vasilis F. Pavlidis (ICCAD, 2017)

STA compatible backend design flow for TSV-based 3-D ICs. - Harry Kalargaris; Yi-Chung Chen; Vasilis F. Pavlidis (ISQED, 2017)

Voltage scaling for 3-D ICs: When, how, and how much? - Harry Kalargaris; Vasilis F. Pavlidis (Microelectron. J., 2017)