W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. - Mariappan Murugesan; Hideto Hashiguchi; Harufumi Kobayashi; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2011)

High density Cu-TSVs and reliability issues. - Mariappan Murugesan; Harufumi Kobayashi; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2011)

A 100GB/s wide I/O with 4096b TSVs through an active silicon interposer with in-place waveform capturing. - Satoshi Takaya; Makoto Nagata; Atsushi Sakai; Takashi Kariya; Shiro Uchiyama; Harufumi Kobayashi; Hiroaki Ikeda (ISSCC, 2013)