Test and debug strategy for TSMC CoWoS™ stacking process based heterogeneous 3D IC: A silicon case study. - Sandeep Kumar Goel; Saman Adham; Min-Jer Wang; Ji-Jan Chen; Tze-Chiang Huang; Ashok Mehta; Frank Lee 004; Vivek Chickermane; Brion L. Keller; Thomas Valind; Subhasish Mukherjee; Navdeep Sood; et al. (ITC, 2013)

Folded Banks: 3D-Stacked HBM Design for Fine-Grained Random-Access Bandwidth. - Vignesh Adhinarayanan; Bradford M. Beckmann; Wantong Li; Mohammad Seyedzadeh; Sergey Blagodurov; Derrick Aguren; Hayden Hyungdong Lee (ISCA, 2025)