Reversible nano-lithography between materials. - Jae Hong Park; Hyun Ik Jang; Jun Yong Park; Dong Eon Lee; Seok Woo Jeon; Woo Choong Kim; Hee Yeoun Kim; Chi Won Ahn (NEMS, 2014)

Wafer-level Packaging Platform for MEMS Sensor Applications. - Taehyun Kim; Junmo Yang; Chungmo Yang; Sung-Hoon Choa; Hee Yeoun Kim (ISOCC, 2024)