How to study delamination in plastic encapsulated devices. - Hélène Frémont; Jean-Yves Delétage; Kirsten Weide-Zaage; Yves Danto (Microelectron. Reliab., 2004)

Moisture diffusion in Printed Circuit Boards: Measurements and Finite- Element- Simulations. - Kirsten Weide-Zaage; Walter Horaud; Hélène Frémont (Microelectron. Reliab., 2005)

Improved physical understanding of intermittent failure in continuous monitoring method. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2006)

Sequential environmental stresses tests qualification for automotive components. - Manoubi Auguste Bahi; Pascal Lecuyer; Hélène Frémont; Jean-Pierre Landesman (Microelectron. Reliab., 2007)

Torsion test applied for reballing and solder paste volume evaluation. - W. C. Maia Filho; M. Brizoux; Hélène Frémont; Yves Danto (Microelectron. Reliab., 2007)

Dynamic void formation in a DD-copper-structure with different metallization geometry. - Kirsten Weide-Zaage; David Dalleau; Yves Danto; Hélène Frémont (Microelectron. Reliab., 2007)

A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages. - Manoubi Auguste Bahi; Hélène Frémont; Jean-Pierre Landesman; Annabelle Gentil; Pascal Lecuyer (Microelectron. Reliab., 2009)

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage. - Maxime Berthou; P. Retailleau; Hélène Frémont; Alexandrine Guédon-Gracia; C. Jéphos-Davennel (Microelectron. Reliab., 2009)

Fast reliability qualification of SiP products. - Charles Regard; Christian Gautier; Hélène Frémont; Patrick Poirier; Xiaosong Ma; Kaspar M. B. Jansen (Microelectron. Reliab., 2009)

Failure analysis case study on a Cu/low-k technology in package: New front-side approach using laser and plasma de-processing. - A. Aubert; J. P. Rebrasse; Lionel Dantas de Morais; Nathalie Labat; Hélène Frémont (Microelectron. Reliab., 2010)

Wearout estimation using the Robustness Validation methodology for components in 150 degreeC ambient automotive applications. - Pascal Lecuyer; Hélène Frémont; Jean-Pierre Landesman; Manoubi Auguste Bahi (Microelectron. Reliab., 2010)

A fast moisture sensitivity level qualification method. - Xiaosong Ma; Kaspar M. B. Jansen; G. Q. Zhang; Willem D. van Driel; Olaf van der Sluis; Leo J. Ernst; C. Regards; Christian Gautier; Hélène Frémont (Microelectron. Reliab., 2010)

Experimental power cycling on insulated TRIAC package: Reliability interpretation thanks to an innovative failure analysis flow. - A. Aubert; Sébastien Jacques; S. Pétremont; Nathalie Labat; Hélène Frémont (Microelectron. Reliab., 2011)

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2011)

PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning. - Olivier Bonnaud; Hélène Frémont; Jean-Marc Thiriet; Hamed Yahoui (ITHET, 2012)

International dimension to increase Lifelong Learning possibilities in Europe. - Jean-Marc Thiriet; Hamed Yahoui; Hélène Frémont (ITHET, 2012)

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength. - Samed Barnat; Hélène Frémont; Alexandrine Guédon-Gracia; Eric Cadalen (Microelectron. Reliab., 2012)

A methodological approach for predictive reliability: Practical case studies. - Hélène Frémont; Geneviève Duchamp; Alexandrine Guédon-Gracia; Frédéric Verdier (Microelectron. Reliab., 2012)

Pushing toward the limits of acceleration: Example on wire-bond assemblies. - Jean-Baptiste Jullien; Bernard Plano; Hélène Frémont (Microelectron. Reliab., 2012)

Migration induced IMC formation in SAC305 solder joints on Cu, NiAu and NiP metal layers. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage (Microelectron. Reliab., 2012)

Electro- and thermo-migration induced failure mechanisms in Package on Package. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2012)

Conductive adhesive joint for extreme temperature applications. - J. B. Jullien; Hélène Frémont; Jean-Yves Delétage (Microelectron. Reliab., 2013)

Electro- and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2013)

Failure analysis of GaAs microwave devices with plastic encapsulation by electro-optical techniques. - W. Ben Naceur; Nathalie Malbert; Nathalie Labat; Hélène Frémont; D. Carisetti; J. C. Clement; J. L. Muraro; Barbara Bonnet (Microelectron. Reliab., 2013)

Qualification procedure for moisture in embedded capacitors. - Hélène Frémont; Jörg Kludt; Massar Wade; Kirsten Weide-Zaage; Isabelle Bord-Majek; Geneviève Duchamp (Microelectron. Reliab., 2014)

Editorial. - Marise Bafleur; Philippe Perdu; François Marc; Hélène Frémont; Nicolas Nolhier (Microelectron. Reliab., 2015)

Virtual prototyping in a Design-for-Reliability approach. - Samed Barnat; Alexandrine Guédon-Gracia; Hélène Frémont (Microelectron. Reliab., 2015)

Characterization and model of temperature effect on the conducted immunity of Op-Amp. - Tristan Dubois; Siham Hairoud; Marcio Hermany Gomes de Oliveira; Hélène Frémont; Geneviève Duchamp (Microelectron. Reliab., 2015)

A methodologic project to characterize and model COTS component reliability. - André Durier; Alain Bensoussan 002; Moustafa Zerarka; Chaimae Ghfiri; Alexandre Boyer; Hélène Frémont (Microelectron. Reliab., 2015)

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps. - Lutz Meinshausen; Hélène Frémont; Kirsten Weide-Zaage; Bernard Plano (Microelectron. Reliab., 2015)

Dynamical IMC-growth calculation. - Lutz Meinshausen; Kirsten Weide-Zaage; Hélène Frémont (Microelectron. Reliab., 2015)

Effects of salt spray test on lead-free solder alloy. - Alexandrine Guédon-Gracia; Hélène Frémont; Bernard Plano; Jean-Yves Delétage; Kirsten Weide-Zaage (Microelectron. Reliab., 2016)

Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach. - S. Hairoud-Airieau; Geneviève Duchamp; Tristan Dubois; Jean-Yves Delétage; André Durier; Hélène Frémont (Microelectron. Reliab., 2017)

Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis. - Nathalie Labat; François Marc; Hélène Frémont; Marise Bafleur (Microelectron. Reliab., 2017)

Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations. - S. Pin; Hélène Frémont; Alexandrine Guédon-Gracia (Microelectron. Reliab., 2017)

High temperature ageing of microelectronics assemblies with SAC solder joints. - Wissam Sabbah; Pierre Bondue; Oriol Avino-Salvado; Cyril Buttay; Hélène Frémont; Alexandrine Guédon-Gracia; Hervé Morel (Microelectron. Reliab., 2017)

Sequential combined thermal cycling and vibration test and simulation of printed circuit board. - Faical Arabi; Alexandrine Guédon-Gracia; Jean-Yves Delétage; Hélène Frémont (Microelectron. Reliab., 2018)

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation. - S. Pin; Alexandrine Guédon-Gracia; Jean-Yves Delétage; Hélène Frémont (Microelectron. Reliab., 2018)

Source Separation Using Sensor's Frequency Response: Theory and Practice on Carbon Nanotubes Sensors. - Aurore Quelennec; Éric Duchesne; Hélène Frémont; Dominique Drouin (Sensors, 2019)

Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors. - Quentin Vandier; Julien Pezard; Hélène Frémont; Éric Duchesne; Dominique Drouin (I2MTC, 2020)

New Method to Perform TDDB Tests for Hybrid Bonding Interconnects. - Bassel Ayoub; Stéphane Moreau; S. Lhostis; P. Lamontagne; H. Combeau; J. G. Mattei; Hélène Frémont (IRPS, 2022)

Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits. - Stéphane Moreau; David Bouchu; J. Jourdon; Bassel Ayoub; S. Lhostis; Hélène Frémont; P. Lamontagne (IRPS, 2023)

Investigation Into the Moisture Degradation Mechanism of Integrated Stacks Using New Moisture Sensor Design. - B. Ayoub; G. Imbert; F. Belfis; T. Parrassin; Sébastien Gallois-Garreignot; L. Mischler; Geneviève Duchamp; Hélène Frémont (IRPS, 2025)