Flexible active cycle stress testing of smart power switches. - Michael Glavanovics; Helmut Köck; Vladimír Kosel; Tobias Smorodin (Microelectron. Reliab., 2007)

IR thermography and FEM simulation analysis of on-chip temperature during thermal-cycling power-metal reliability testing using in situ heated structures. - Helmut Köck; Vladimír Kosel; Christian Djelassi; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2009)

ANSYS based 3D electro-thermal simulations for the evaluation of power MOSFETs robustness. - Stefano de Filippis; Vladimír Kosel; Donald Dibra; Stefan Decker; Helmut Köck; Andrea Irace (Microelectron. Reliab., 2011)

Improved thermal management of low voltage power devices with optimized bond wire positions. - Helmut Köck; Christian Djelassi; Stefano de Filippis; Robert Illing; Michael Nelhiebel; Markus Ladurner; Michael Glavanovics; Dionyz Pogany (Microelectron. Reliab., 2011)

Modeling of highly anisotropic microstructures for electro-thermal simulations of power semiconductor devices. - Stefano de Filippis; Helmut Köck; Michael Nelhiebel; Vladimír Kosel; Stefan Decker; Michael Glavanovics; Andrea Irace (Microelectron. Reliab., 2012)