Fracture morphology and mechanism of IMC in Low-Ag SAC Solder/UBM (Ni(P)-Au) for WLCSP. - Fenglian Sun; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. (Kouchi) Zhang (Microelectron. Reliab., 2008)

Solder interconnect reliability under drop impact loading conditions using High-speed Cold Bump Pull. - Jeroen J. M. Zaal; Hendrik Pieter Hochstenbach; Willem D. van Driel; G. Q. Zhang (Microelectron. Reliab., 2009)

Designing for reliability using a new Wafer Level Package structure. - Hendrik Pieter Hochstenbach; Willem D. van Driel; Dao-Guo Yang; Jeroen J. M. Zaal; E. Bagerman (Microelectron. Reliab., 2010)