Learning Based Compact Thermal Modeling for Energy-Efficient Smart Building Management: (invited). - Hengyang Zhao; Daniel Quach; Shujuan Wang; Hai Wang 002; Hai-Bao Chen; Xin Li 001; Sheldon X.-D. Tan (ICCAD, 2015)

Thermal modeling for energy-efficient smart building with advanced overfitting mitigation technique. - Wandi Liu; Hai Wang 002; Hengyang Zhao; Shujuan Wang; Hai-Bao Chen; Yuzhuo Fu; Jian Ma 002; Xin Li 001; Sheldon X.-D. Tan (ASP-DAC, 2016)

Invited - Cross-layer modeling and optimization for electromigration induced reliability. - Taeyoung Kim 001; Zeyu Sun 001; Chase Cook; Hengyang Zhao; Ruiwen Li; Daniel Wong 001; Sheldon X.-D. Tan (DAC, 2016)

Learning-based occupancy behavior detection for smart buildings. - Hengyang Zhao; Zhongdong Qi; Shujuan Wang; Kambiz Vafai; Hai Wang 002; Hai-Bao Chen; Sheldon X.-D. Tan (ISCAS, 2016)

Online Unusual Behavior Detection for Temperature Sensor Networks. - Hengyang Zhao; Sheldon X.-D. Tan; Hai Wang 002; Hai-Bao Chen (ISVLSI, 2016)

Parallel GMRES solver for fast analysis of large linear dynamic systems on GPU platforms. - Kai He; Sheldon X.-D. Tan; Hengyang Zhao; Xuexin Liu; Hai Wang 002; Guoyong Shi (Integr., 2016)

Fast two-dimensional finite element analysis for power network DC integrity checks of PCBs. - Wei He; Hengyang Zhao; Zhongdong Qi; Hai-Bao Chen; Sheldon X.-D. Tan (ASICON, 2017)

Dynamic temperature-aware reliability modeling for multi-branch interconnect trees. - Jiangtao Peng; Hai-Bao Chen; Hengyang Zhao; Zeyu Sun 001; Sheldon X.-D. Tan (ASICON, 2017)

Recovery-aware proactive TSV repair for electromigration in 3D ICs. - Shengcheng Wang; Hengyang Zhao; Sheldon X.-D. Tan; Mehdi Baradaran Tahoori (DATE, 2017)

Accelerating electromigration aging for fast failure detection for nanometer ICs. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (ASP-DAC, 2018)

Electromigration-lifetime constrained power grid optimization considering multi-segment interconnect wires. - Han Zhou 002; Yijing Sun; Zeyu Sun 001; Hengyang Zhao; Sheldon X.-D. Tan (ASP-DAC, 2018)

Multi-physics-based FEM analysis for post-voiding analysis of electromigration failure effects. - Hengyang Zhao; Sheldon X.-D. Tan (ICCAD, 2018)

Thermal-Sensor-Based Occupancy Detection for Smart Buildings Using Machine-Learning Methods. - Hengyang Zhao; Qi Hua; Hai-Bao Chen; Yaoyao Ye; Hai Wang 002; Sheldon X.-D. Tan; Esteban Tlelo-Cuautle (ACM Trans. Design Autom. Electr. Syst., 2018)

Postvoiding FEM Analysis for Electromigration Failure Characterization. - Hengyang Zhao; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2018)

Hot Spot Identification and System Parameterized Thermal Modeling for Multi-Core Processors Through Infrared Thermal Imaging. - Sheriff Sadiqbatcha; Hengyang Zhao; Hussam Amrouch; Jörg Henkel; Sheldon X.-D. Tan (DATE, 2019)

GPU-based Ising computing for solving max-cut combinatorial optimization problems. - Chase Cook; Hengyang Zhao; Takashi Sato 001; Masayuki Hiromoto; Sheldon X.-D. Tan (Integr., 2019)

Saturation-Volume Estimation for Multisegment Copper Interconnect Wires. - Zeyu Sun 001; Sheriff Sadiqbatcha; Hengyang Zhao; Sheldon X.-D. Tan (IEEE Trans. Very Large Scale Integr. Syst., 2019)

Post-Silicon Heat-Source Identification and Machine-Learning-Based Thermal Modeling Using Infrared Thermal Imaging. - Sheriff Sadiqbatcha; Jinwei Zhang; Hengyang Zhao; Hussam Amrouch; Jörg Henkel; Sheldon X.-D. Tan (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2021)

Localization of Partial Discharge in Electrical Transformer Considering Multimedia Refraction and Diffraction. - Jun Jia; Chengbo Hu; Qiang Yang 004; Yuncai Lu; Bo Wang 047; Hengyang Zhao (IEEE Trans. Ind. Informatics, 2021)

Application of Multiscale Sample Entropy in Assessing Effects of Exercise Training on Skin Blood Flow Oscillations in People with Spinal Cord Injury. - Fuyuan Liao; Hengyang Zhao; Cheng-Feng Lin; Panpan Chen; Philbert Chen; Kingsley Onyemere; Yih-Kuen Jan (Entropy, 2023)