Transient IR imaging of light and flexible microelectronic devices. - Zoran Radivojevic; Ivan Kassamakov; Markku Oinonen; H. Saarikko; Henri Seppänen; Pasi Vihinen (Microelectron. Reliab., 2006)

Predicting bond failure after 1.5 ms of bonding, an initial study. - Aino Tietäväinen; Timo Rauhala; Henri Seppänen; Risto Kurppa; Antti I. Meriläinen; Edward Hæggström (Microelectron. Reliab., 2014)