Batteries and Power Supplies for Wearable and Ubiquitous Computing. - Robert Hahn; Herbert Reichl (ISWC, 1999)

Bump formation for flip chip and CSP by solder paste printing. - Joachim Kloeser; Paradiso Coskina; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2002)

Technical challenges of stencil printing technology for ultra fine pitch flip chip bumping. - Dionysios Manessis; Rainer Patzelt; Andreas Ostmann; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2004)

Long time reliability study of soldered flip chips on flexible substrates. - Barbara Pahl; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2004)

Parametric FE-approach to flip-chip reliability under various loading conditions. - Bernhard Wunderle; Wolfgang Nüchter; Andreas Schubert; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2004)

Packaging Challenges in Miniaturization. - Christine Kallmayer; M. Niedermayer; Stephan Guttowski; Herbert Reichl (Ambient Intelligence, 2005)

Embroidering Electrical Interconnects with Conductive Yarn for The Integration of Flexible Electronic Modules into Fabric. - Torsten Linz; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (ISWC, 2005)

Closed-form network representations of frequency-dependent RLGC parameters. - A. Ege Engin; Wolfgang Mathis; Werner John; Grit Sommer; Herbert Reichl (Int. J. Circuit Theory Appl., 2005)

Reliability Potential Of Epoxy Based Encapsulants For Automotive Applications. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2005)

Characterization of bump arrays at RF/microwave frequencies. - Ivan N. Ndip; Grit Sommer; Werner John; Herbert Reichl (Microelectron. Reliab., 2005)

Fully Integrated EKG Shirt based on Embroidered Electrical Interconnections with Conductive Yarn and Miniaturized Flexible Electronics. - Torsten Linz; Christine Kallmayer; Rolf Aschenbrenner; Herbert Reichl (BSN, 2006)

Vorhersage von magnetischen Kopplungen in Filterschaltungen. - Andre Lissner; Eckart Hoene; Stephan Guttowski; Werner John; Herbert Reichl (EMV, 2006)

Modellierung geschirmter Leistungskabel im Frequenzbereich der EMV. - Stefan-Peter Weber; André Linde; Eckart Hoene; Stephan Guttowski; Werner John; Herbert Reichl (EMV, 2006)

Miniaturization platform for wireless sensor nodes based on 3D-packaging technologies. - M. Niedermayer; Stephan Guttowski; Rolf Thomasius; David Dmitry Polityko; K. Schrank; Herbert Reichl (IPSN, 2006)

High-temperature reliability of Flip Chip assemblies. - Tanja Braun; Karl-Friedrich Becker; Mathias Koch; Volker Bader; Rolf Aschenbrenner; Herbert Reichl (Microelectron. Reliab., 2006)

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array - Erik Jung; Dionysios Manessis; Alexander Neumann 002; Lars Böttcher; Tanja Braun; Jörg Bauer 002; Herbert Reichl; Bruno Iafelice; Federica Destro; Roberto Gambari (CoRR, 2008)

Technologies for 3D Heterogeneous Integration - Jürgen Wolf; Peter Ramm; Armin Klumpp; Herbert Reichl (CoRR, 2008)

Optimization of efficiency and energy density of passive micro fuel cells and galvanic hydrogen generators - Robert Hahn; Stefan Wagner 006; Steffen Krumbholz; Herbert Reichl (CoRR, 2008)

3-D thin chip integration technology - from technology development to application. - Thomas Fritzsch; Raul Mrossko; Tobias Baumgartner 003; Michael Toepper; Matthias Klein; Jürgen Wolf; Bernhard Wunderle; Herbert Reichl (3DIC, 2009)

SENESCOPE: A design tool for cost optimization of wireless sensor nodes. - M. Niedermayer; C. Richter; J. Hefer; Stephan Guttowski; Herbert Reichl (IPSN, 2009)

Stretchable Circuit Board Technology and Application. - Rene Vieroth; Thomas Löher; Manuel Seckel; Christian Dils; Christine Kallmayer; Andreas Ostmann; Herbert Reichl (ISWC, 2009)

Entwurf von Aufbau- und Verbindungstechniken für die Elektromagnetische Zuverlässigkeit von Mikrosystemen unter Verwendung des M3-Ansatzes. - Herbert Reichl; Ivan N. Ndip (MBMV, 2009)

Molecular dynamics approach to structure-property correlation in epoxy resins for thermo-mechanical lifetime modeling. - Bernhard Wunderle; E. Dermitzaki; O. Hölck; Jörg Bauer 002; Hans Walter; Q. Shaik; K. Rätzke; Franz Faupel; Bernd Michel; Herbert Reichl (Microelectron. Reliab., 2010)

Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds. - Thomas Schreier-Alt; Frank Rehme; Frank Ansorge; Herbert Reichl (Microelectron. Reliab., 2011)