Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling. - Herman Oprins; J. Danneels; B. Van Ham; Bart Vandevelde; Martine Baelmans (Microelectron. J., 2008)

Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. - Geert Van der Plas; Steven Thijs; Dimitri Linten; Guruprasad Katti; Paresh Limaye; Abdelkarim Mercha; Michele Stucchi; Herman Oprins; Bart Vandevelde; Nikolaos Minas; Miro Cupac; Morin Dehan; et al. (CICC, 2010)

3D integration: Circuit design, test, and reliability challenges. - Nikolaos Minas; Ingrid De Wolf; Erik Jan Marinissen; Michele Stucchi; Herman Oprins; Abdelkarim Mercha; Geert Van der Plas; Dimitrios Velenis; Pol Marchal (IOLTS, 2010)

Design issues and considerations for low-cost 3D TSV IC technology. - Geert Van der Plas; Paresh Limaye; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Domae Shinichi; Vladimir Cherman; et al. (ISSCC, 2010)

DRAM-on-logic Stack - Calibrated thermal and mechanical models integrated into PathFinding flow. - Dragomir Milojevic; Herman Oprins; Julien Ryckaert; Paul Marchal; Geert Van der Plas (CICC, 2011)

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. - Geert Van der Plas; Paresh Limaye; Igor Loi; Abdelkarim Mercha; Herman Oprins; Cristina Torregiani; Steven Thijs; Dimitri Linten; Michele Stucchi; Guruprasad Katti; Dimitrios Velenis; Vladimir Cherman; et al. (IEEE J. Solid State Circuits, 2011)

Fine grain thermal modeling and experimental validation of 3D-ICs. - Herman Oprins; Adi Srinivasan; Miroslav Cupák; Vladimir Cherman; Cristina Torregiani; Michele Stucchi; Geert Van der Plas; Paul Marchal; Bart Vandevelde; E. Cheng (Microelectron. J., 2011)

Modeling and Control of Electrowetting Induced Droplet Motion. - Herman Oprins; Bart Vandevelde; Martine Baelmans (Micromachines, 2012)

Fast convolution based thermal model for 3D-ICs: Methodology, accuracy analysis and package impact. - F. L. T. Maggioni; Herman Oprins; Eric Beyne; Ingrid De Wolf; Martine Baelmans (Microelectron. J., 2014)

Thermal experimental and modeling analysis of high power 3D packages. - Herman Oprins; Vladimir Cherman; Geert Van der Plas; F. L. T. Maggioni; Joeri De Vos; Eric Beyne (ICICDT, 2015)

New fast distributed thermal model for analysis of GaN based power devices. - Vice Sodan; Federica Lidia Teresa Maggioni; Herman Oprins; Steve Stoffels; Martine Baelmans; Ingrid De Wolf (ESSDERC, 2016)

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications. - Kris Croes; Veerle Simons; Sofie Beyne; Vladimir Cherman; Herman Oprins; Michele Stucchi; Philippe Absil; A. Glabman; Eric Wilcox (IRPS, 2019)

Thermal Performance Analysis of Mempool RISC-V Multicore SoC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2022)

Towards accurate temperature prediction in BEOL for reliability assessment (Invited). - Melina Lofrano; Herman Oprins; Xinyue Chang; Bjorn Vermeersch; Olalla Varela Pedreira; Alicja Lesniewska; Vladimir Cherman; Ivan Ciofi; Kristof Croes; Seongho Park; Zsolt Tokei (IRPS, 2023)

Towards Chip-Package-System Co-optimization of Thermally-limited System-On-Chips (SOCs). - Subrat Mishra; Sankatali Venkateswarlu; Bjorn Vermeersch; Moritz Brunion; Melina Lofrano; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Gaspard Hiblot; Geert Van der Plas; Pieter Weckx; et al. (IRPS, 2023)

Coupled Dynamic Thermo-Optical Analysis and Compact Modelling of Self-Heating in Ring Modulator. - David Coenen; Minkyu Kim; Herman Oprins; Ingrid De Wolf; Yoojin Ban; Joris Van Campenhout (PSC, 2023)

Benchmarking of Machine Learning Methods for Multiscale Thermal Simulation of Integrated Circuits. - David Coenen; Herman Oprins; Robin Degraeve; Ingrid De Wolf (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2023)

Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC. - Sankatali Venkateswarlu; Subrat Mishra; Herman Oprins; Bjorn Vermeersch; Moritz Brunion; Jun-Han Han; Mircea R. Stan; Dwaipayan Biswas; Pieter Weckx; Francky Catthoor (IEEE Trans. Very Large Scale Integr. Syst., 2023)

Thermal Performance Evaluation of Multi-Core SOCs Using Power-Thermal Co-Simulation. - Subrat Mishra; Bjorn Vermeersch; Sankatali Venkateswarlu; Halil Kukner; A. Sharma; G. Mirabeli; Fabian M. Bufler; Moritz Brunion; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; et al. (IRPS, 2024)

Thermal Analysis of 3D Stacking and BEOL Technologies with Functional Partitioning of Many-Core RISC-V SoC. - Mohamed Naeim; Herman Oprins; Sudipta Das; Geert Van der Plas; Yun Dai; Pinhong Chen; CT Kao; Dwaipayan Biswas; Dragomir Milojevic (ISVLSI, 2024)

Thermal Considerations for Block-Level PPA Assessment in Angstrom Era: A Comparison Study of Nanosheet FETs (A10) & Complementary FETs (A5). - S. Mishra; Bjorn Vermeersch; Sankatali Venkateswarlu; Halil Kukner; Gioele Mirabelli; Fabian M. Bufler; Moritz Brunion; Dawit Burusie Abdi; Herman Oprins; Dwaipayan Biswas; Odysseas Zografos; Francky Catthoor; et al. (VLSI Technology and Circuits, 2024)

Multidie 3-D Stacking of Memory Dominated Neuromorphic Architectures. - Leandro Mateus Giacomini Rocha; Refik Bilgic; Mohamed Naeim; Sudipta Das; Herman Oprins; Amirreza Yousefzadeh; Mario Konijnenburg; Dragomir Milojevic; James Myers; Julien Ryckaert; Dwaipayan Biswas (IEEE Trans. Very Large Scale Integr. Syst., 2024)