7.1 54×42 LiDAR 3D-Stacked System-On-Chip with On-Chip Point Cloud Processing and Hybrid On-Chip/Package-Embedded 25V Boost Generation. - Neale A. W. Dutton; Xavier Branca; Mathieu Thivin; Steven Collins; Herve Thuaire; Fabrice Martin; Vincent Clemencon; Mohammed Al-Rawhani; Duncan Hall; Axel Crocherie; Cédric Pastorelli; Sophie Taupin; et al. (ISSCC, 2026)