Improvement on sheet resistance uniformity of nickel silicide by optimization of silicidation conditions. - Ryuji Tomita; Hidehiko Kimura; M. Yasuda; K. Maeda; S. Ueno; T. Tonegawa; T. Fujimoto; M. Moritoki; Hiroshi Iwai (Microelectron. Reliab., 2013)

Formation of high resistivity phases of nickel silicide at small area. - Ryuji Tomita; Hidehiko Kimura; M. Yasuda; K. Maeda; S. Ueno; T. Tomizawa; Y. Kunimune; H. Nakamura; M. Moritoki; Hiroshi Iwai (Microelectron. Reliab., 2013)

Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography. - Masanori Usui; Hidehiko Kimura; Toshikazu Satoh; Takashi Asada; Satoshi Yamaguchi; Masashi Kato (Microelectron. Reliab., 2016)

Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding. - Masanori Usui; Toshikazu Satoh; Hidehiko Kimura; S. Tajima; Y. Hayashi; Daigo Setoyama; Masashi Kato (Microelectron. Reliab., 2017)

Quantification of lead-free solder fatigue by EBSD analysis. - T. Fujiwara; K. Yamamoto; Hidehiko Kimura (Microelectron. Reliab., 2018)

The First Application of a Gd3Al2Ga3O12: Ce Single-Crystal Scintillator to Neutron Radiography. - Kazuhisa Isegawa; Daigo Setoyama; Hidehiko Kimura; Takenao Shinohara (J. Imaging, 2021)