Wafer-level vacuum packaging for hetero-integration by thermo-compression bonding using planarized-electroplated gold bumps. - Muhammad Salman Al Farisi; Hideki Hirano; Shuji Tanaka (NEMS, 2016)

Development of a Real-Time Force and Temperature Sensing System with MEMS-LSI Integrated Tactile Sensors for Next-Generation Robots. - Masanori Muroyama; Hideki Hirano; Chenzhong Shao; Shuji Tanaka (J. Robotics Mechatronics, 2020)