Preferable Improvements and Changes to FB-DiMM High-Speed Channel for 9.6Gbps Operation. - Atsushi Hiraishi; Toshio Sugano; Hideki Kusamitsu (ASP-DAC, 2007)

1 Gb/s, 50 µm × 50 µm Pads on Board Wireless Connector Based on Track-and-Charge Scheme Allowing Contacted Signaling. - Katsuyuki Ikeuchi; Hideki Kusamitsu; Mutsuo Daito; Gil-Su Kim; Makoto Takamiya; Takayasu Sakurai (IEICE Trans. Electron., 2011)

Capacitively Coupled Non-Contact Probing Circuits for Membrane-Based Wafer-Level Simultaneous Testing. - Mutsuo Daito; Yoshiro Nakata; Satoshi Sasaki; Hiroyuki Gomyo; Hideki Kusamitsu; Yoshio Komoto; Kunihiko Iizuka; Katsuyuki Ikeuchi; Gil-Su Kim; Makoto Takamiya; Takayasu Sakurai (IEEE J. Solid State Circuits, 2011)