Minimization of the local residual stress in 3DICs by controlling the structures and mechanical properties of 3D interconnections. - Kota Nakahira; Fumiaki Endo; Ryosuke Furuya; Ken Suzuki; Hideo Miura (3DIC, 2011)

Mechanical and electrical reliability of copper interconnections for 3DIC. - Naoki Saito 004; Naokazu Murata; Kinji Tamakawa; Ken Suzuki; Hideo Miura (3DIC, 2011)

Variation of thermal stress in TSV structures caused by crystallinity of electroplated copper interconnections. - Jiatong Liu; Ken Suzuki; Hideo Miura (3DIC, 2015)

Thermal stability of electroplated copper thin-film interconnections. - Pornvitoo Rittinon; Ken Suzuki; Hideo Miura (3DIC, 2015)

Crystallinity Dependence of Long-Term Reliability of Electroplated Gold Thin-Film Interconnections. - Ken Suzuki; Ryota Mizuno; Yutaro Nakoshi; Hideo Miura (3DIC, 2019)