W/Cu TSVs for 3D-LSI with minimum thermo-mechanical stress. - Mariappan Murugesan; Hideto Hashiguchi; Harufumi Kobayashi; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2011)

Transfer and non-transfer stacking technologies based on chip-to-wafer self-asembly for high-throughput and high-precision alignment and microbump bonding. - Takafumi Fukushima; Taku Suzuki; Hideto Hashiguchi; Chisato Nagai; Jichoel Bea; Hiroyuki Hashimoto; Mariappan Murugesan; Kang Wook Lee 002; Tetsu Tanaka; Kazushi Asami; Yasuhiro Kitamura; Mitsumasa Koyanagi (3DIC, 2015)

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. - Hisashi Kino; Hideto Hashiguchi; Seiya Tanikawa; Yohei Sugawara; Shunsuke Ikegaya; Takafumi Fukushima; Mitsumasa Koyanagi; Tetsu Tanaka (3DIC, 2015)

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. - K. W. Lee; Chisato Nagai; Ai Nakamura; Hiroki Aizawa; Ji Chel Bea; Mitsumasa Koyanagi; Hideto Hashiguchi; Takafumi Fukushima; Tanaka Tanaka (3DIC, 2015)

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. - Takafumi Fukushima; Hideto Hashiguchi; Hiroshi Yonekura; Hisashi Kino; Mariappan Murugesan; Ji Chel Bea; Kang Wook Lee 002; Tetsu Tanaka; Mitsumasa Koyanagi (Micromachines, 2016)