US Microelectronics Packaging Ecosystem: Challenges and Opportunities. - Rouhan Noor; Himanandhan Reddy Kottur; Patrick J. Craig; Liton Kumar Biswas; M. Shafkat M. Khan; Nitin Varshney; Hamed Dalir; Elif Akçali; Bahar Ghane Motlagh; Charles Woychik; Yong-Kyu Yoon; Navid Asadizanjani (CoRR, 2023)

Interactive Learning in Microelectronics Education: Comparing PC and Mixed Reality Approaches for Student Engagement and Visual-Spatial Memory. - Pavanbabu Arjunamahanthi; Himanandhan Reddy Kottur; Austin Jerald Stanbury; Juan Francisco Lam; Serene Cheon; Navid Asadizanjani; Hyo Kang (CHI Extended Abstracts, 2025)

Toward Standardized Vulnerability Assessment of Advanced Packaging Against Probing Attacks. - M. Shafkat M. Khan; Liton Kumar Biswas; Himanandhan Reddy Kottur; Rouhan Noor; Nitin Varshney; Nelson Hastings; Navid Asadizanjani (IEEE Des. Test, 2025)