Local damage free Si substrate ultra thinning for backside emission spectral analysis using OBPF for LSI failure mode detection. - Takuya Naoe; Tamao Ikeuchi; Chie Moritni; Hirohiko Endoh; Kohichi Yokoyama (Microelectron. Reliab., 2013)

Copper wire bonding package decapsulation using the anodic protection method. - Hirohiko Endoh; Takuya Naoe (Microelectron. Reliab., 2015)