Polymer film deposition with fine pitch openings by stencil printing. - Hirokazu Ezawa; Masaharu Seto; Masahiro Miyata; Hiroshi Tazawa (Microelectron. Reliab., 2003)

The sprint process of Al interconnects with low-temperature PVD via filling. - Takashi Yoda; Hirokazu Ezawa; Kaori Tsutsumi; Makoto Honda (IEICE Electron. Express, 2004)

A 40 nm 222 mW H.264 Full-HD Decoding, 25 Power Domains, 14-Core Application Processor With x512b Stacked DRAM. - Yu Kikuchi; Makoto Takahashi; Tomohisa Maeda; Masatoshi Fukuda; Yasuhiro Koshio; Hiroyuki Hara; Hideho Arakida; Hideaki Yamamoto; Yousuke Hagiwara; Tetsuya Fujita; Manabu Watanabe; Hirokazu Ezawa; et al. (IEEE J. Solid State Circuits, 2011)