Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers. - K. W. Lee; Chisato Nagai; Ai Nakamura; Hiroki Aizawa; Ji Chel Bea; Mitsumasa Koyanagi; Hideto Hashiguchi; Takafumi Fukushima; Tanaka Tanaka (3DIC, 2015)

Stability of Bifurcating Patterns of Spatial Economy Models on a Hexagonal Lattice. - Kiyohiro Ikeda; Hiroki Aizawa; Yosuke Kogure; Yuki Takayama (Int. J. Bifurc. Chaos, 2018)

Invariant Patterns for Replicator Dynamics on a Hexagonal Lattice. - Kiyohiro Ikeda; Yosuke Kogure; Hiroki Aizawa; Yuki Takayama (Int. J. Bifurc. Chaos, 2019)

Breaking and Sustaining Bifurcations in SN-Invariant Equidistant Economy. - Hiroki Aizawa; Kiyohiro Ikeda; Minoru Osawa; José M. Gaspar (Int. J. Bifurc. Chaos, 2020)

Group-Theoretic Bifurcation Mechanism of Economic Agglomerations on a Square Lattice. - Yosuke Kogure; Kiyohiro Ikeda; Hiroki Aizawa (Int. J. Bifurc. Chaos, 2021)

Bifurcation Mechanism at a Sustain Point of a Long Narrow Economy. - Kiyohiro Ikeda; Hiroki Aizawa; José M. Gaspar (Int. J. Bifurc. Chaos, 2024)