Pattern recognition techniques for hybrid microcircuits. - Masato Nakashima; Tetsuo Koezuka; Hiroyuki Tsukahara; Takefumi Inagaki (ICRA, 1984)

High-speed solder bump inspection system using a laser scanner and CCD camera. - Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishino; Moritoshi Ando (Syst. Comput. Jpn., 2000)