Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. - Ji Chel Bea; Mariappan Murugesan; Yuki Ohara; Akihiro Noriki; Hisashi Kino; Kang Wook Lee 002; Takafumi Fukushima; Tetsu Tanaka; Mitsumasa Koyanagi (3DIC, 2009)

Multiple optical stimulation to neuron using Si opto-neural probe with multiple optical waveguides and metal-cover for optogenetics. - Shota Kanno; Sang-Rim Lee; T. Harashima; Toshinobu Kuki; Hisashi Kino; Hajime Mushiake; Hongyi Yao; Tetsu Tanaka (EMBC, 2013)

Consideration of microbump layout for reduction of local bending stress due to CTE Mismatch in 3D IC. - Hisashi Kino; Hideto Hashiguchi; Seiya Tanikawa; Yohei Sugawara; Shunsuke Ikegaya; Takafumi Fukushima; Mitsumasa Koyanagi; Tetsu Tanaka (3DIC, 2015)

Novel local stress evaluation method in 3D IC using DRAM cell array with planar mOS capacitors. - Seiya Tanikawa; Hisashi Kino; Takafumi Fukushima; Mitsumasa Koyanagi; Tetsu Tanaka (3DIC, 2015)

Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler. - Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2016)

Wide-range and precise tissue impedance analysis circuit with ultralow current source using gate-induced drain-leakage current. - Koji Kiyoyama; Yoshiki Takezawa; Tatsuya Goto; Keita Ito; Shoma Uno; Kenji Shimokawa; Satoru Nishino; Hisashi Kino; Tetsu Tanaka (BioCAS, 2016)

Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration. - Takafumi Fukushima; Hideto Hashiguchi; Hiroshi Yonekura; Hisashi Kino; Mariappan Murugesan; Ji Chel Bea; Kang Wook Lee 002; Tetsu Tanaka; Mitsumasa Koyanagi (Micromachines, 2016)

Experimental evaluation of stimulus current generator with Laplacian edge-enhancement for 3-D stacked retinal prosthesis chip. - Kenji Shimokawa; Zhengyang Qian; Yoshiki Takezawa; Hisashi Kino; Takafumi Fukushima; Kouji Kiyoyama; Tetsu Tanaka (BioCAS, 2017)

Ultrawide range square wave impedance analysis circuit with ultra-slow ring-oscillator using gate-induced drain-leakage current. - Yoshiki Takezawa; Koji Kiyoyama; Kenji Shimokawa; Zhengyang Qian; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (BioCAS, 2017)

Continuous Peripheral Blood Pressure Measurement with ECG and PPG Signals at Fingertips. - Kar Mun Lee; Zhengyang Qian; Ryosuke Yabuki; Bang Du; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama; Tetsu Tanaka (BioCAS, 2018)

Investigation of the Underfill with Negative-Thermal-Expansion Material to Suppress Mechanical Stress in 3D Integration System. - Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)

Development of a CDS Circuit for 3-D Stacked Neural Network Chip using CMOS Analog Signal Processing. - Koji Kiyoyama; Qian Zhengy; Hiroyuki Hashimoto; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)

Development of 3D-IC Embedded Flexible Hybrid System. - Sungho Lee; Yuki Susumago; Zhengyang Qian; Noriyuki Takahashi; Hisashi Kino; Tetsu Tanaka; Takafumi Fukushima (3DIC, 2019)

Impacts of Deposition Temperature and Annealing Condition on Ozone-Ethylene Radical Generation-TEOS-CVD SiO2 for Low-Temperature TSV Liner Formation. - Rui Liang; Sungho Lee; Yuki Miwa; Kousei Kumahara; Mariappan Murugesan; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)

Characterization of Low-Height Solder Microbump Bonding for Fine-Pitch Inter-Chip Connection in 3DICs. - Yuki Miwa; Sungho Lee; Rui Liang; Kousei Kumahara; Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2019)

PPG and SpO2 Recording Circuit with Ambient Light Cancellation for Trans-Nail Pulse-Wave Monitoring System. - Ryosuke Yabuki; Tetsu Tanaka; Zhengyang Qian; Kar Mun Lee; Bang Du; Filipe Alves Satake; Tasuku Fukushima; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama (BioCAS, 2019)

Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing. - Takafumi Fukushima; Shinichi Sakuyama; Masatomo Takahashi; Hiroyuki Hashimoto; Jichoel Bea; Theodorus Marcello; Hisashi Kino; Tetsu Tanaka; Mitsumasa Koyanagi; Mariappan Murugesan (3DIC, 2021)

Design and Evaluation of Electronic-Microsaccade with Balanced Stimulation for Artificial Vision System. - Yaogan Liana; Zhengyang Qian; Bang Du; Jinming Ye; Kohei Nakamura; Shengwei Wang; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama; Tetsu Tanaka (BioCAS, 2021)

Implementation of Light and Dark Adaptation Function for High QOL 3D-Stacked Artificial Retina Chip. - Kohei Nakamura; Yaogan Liang; Bang Du; Shengwei Wang; Yuta Aruga; Bunta Inoue; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama; Tetsu Tanaka (BioCAS, 2022)

3D-stacked retinal prosthesis chip with binary image capture and edge detection functions for human visual restoration. - Yaogan Liang; Bang Du; Kohei Nakamura; Shengwei Wang; Bunta Inoue; Yuta Aruga; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama; Tetsu Tanaka (IEICE Electron. Express, 2022)

Impact of Super-long-throw PVD on TSV Metallization and Die-to-Wafer 3D Integration Based on Via-last. - Jiayi Shen; Chang Liu; Tadaaki Hoshi; Atsushi Shinoda; Hisashi Kino; Tetsu Tanaka; Mariappan Murugesan; Mitsumasa Koyanagi; Takafumi Fukushima (3DIC, 2023)

Development of Trans-nail PPG Controller Using Fingertip Blood Volume Changes to Enable Highly Accurate Motion Prediction. - Kohei Nakamura; Bang Du; Keishun Sugishita; Ryo Hasegawa; Hisashi Kino; Takafumi Fukushima; Koji Kiyoyama; Tetsu Tanaka (BioCAS, 2023)

Supression of TSV-Induced Stress by Using Negative Thermal Expansion Material. - Hisashi Kino; Takafumi Fukushima; Tetsu Tanaka (3DIC, 2024)