Using ATMS to Efficiently Verify the Termination of Rewrite Rule Programs. - Masahito Kurihara; Hisashi Kondo; Azuma Ohuchi (Int. J. Softw. Eng. Knowl. Eng., 1992)

Completion for Multiple Reduction Orderings. - Masahito Kurihara; Hisashi Kondo; Azuma Ohuchi (RTA, 1995)

An Efficient Compact Test Generator for IDDQ Testing. - Hisashi Kondo; Kwang-Ting Cheng (Asian Test Symposium, 1996)

Driving toward higher IDDQ test quality for sequential circuits: a generalized fault model and its ATPG. - Hisashi Kondo; Kwang-Ting Cheng (ICCAD, 1996)

Completion of term-rewriting systems with multiple reduction orderings. - Hisashi Kondo; Masahito Kurihara; Azuma Ohuchi (Syst. Comput. Jpn., 1996)

Heuristics and Experiments on BDD Representation of Boolean Functions for Expert Systems in Software Verification Domains. - Masahito Kurihara; Hisashi Kondo (Australian Joint Conference on Artificial Intelligence, 1999)

Completion for Multiple Reduction Orderings. - Masahito Kurihara; Hisashi Kondo (J. Autom. Reason., 1999)

BDD encoding for partial order constraints and its application to expert systems in software verification domains. - Masahito Kurihara; Hisashi Kondo (SMC, 2000)

Dynamic control of curve-constrained hyper-redundant manipulators. - Shugen Ma; Mitsuru Watanabe; Hisashi Kondo (CIRA, 2001)

Efficient BDD Encodings for Partial Order Constraints with Application to Expert Systems in Software Verification. - Masahito Kurihara; Hisashi Kondo (IEA/AIE, 2004)

Earable TEMPO: A Novel, Hands-Free Input Device that Uses the Movement of the Tongue Measured with a Wearable Ear Sensor. - Kazuhiro Taniguchi; Hisashi Kondo; Mami Kurosawa; Atsushi Nishikawa (Sensors, 2018)

Voltage Surges by Backside ESD Impacts on IC Chip in Flip Chip Packaging. - Takuya Wadatsumi; Kohei Kawai; Rikuu Hasegawa; Takuji Miki; Makoto Nagata; Kikuo Muramatsu; Hiromu Hasegawa; Takuya Sawada; Takahito Fukushima; Hisashi Kondo (IRPS, 2022)

Proposal for a Highly Reliable In-Vehicle Optical Network: SiPhON (Si-Photonics-Based In-Vehicle Optical Network). - Hiroyuki Tsuda; Ryogo Kubo; Tatsuo Furuya; Masayuki Iwase; Masahito Morimoto; Hisashi Kondo; Yasushi Amamiya; Yoshiaki Nakano; Takuo Tanemura; Masayuki Murata 001; Shin'ichi Arakawa; Naokatsu Yamamoto; et al. (OECC/PSC, 2022)

Experimental Exploration of the Backside ESD Impacts on an IC Chip in Flip Chip Packaging. - Takuya Wadatsumi; Kohei Kawai; Rikuu Hasegawa; Kikuo Muramatsu; Hiromu Hasegawa; Takuya Sawada; Takahito Fukushima; Hisashi Kondo; Takuji Miki; Makoto Nagata (IEICE Trans. Electron., 2023)