Best engineering practice for thermal characterization of stacked dice FPGA devices. - Arun Raghupathy; Hoa Do; Brian Philofsky; Gamal Refai-Ahmed (3DIC, 2015)

CCECE 2021 Invited Paper: Holistic Performance, Reliability and Thermal Understanding of HPC Real Utilization on Silicon Architecture. - Gamal Refai-Ahmed; Hoa Do; I-Ru Chen; Jae-Gyung Ahn; Huayan Wang; Xin Wu; Suresh Ramalingam (CCECE, 2021)

TueSents at SemEval-2024 Task 8: Predicting the Shift from Human Authorship to Machine-generated Output in a Mixed Text. - Valentin Pickard; Hoa Do (SemEval@NAACL, 2024)