Robust Simulation Methodology for Surface-Roughness Loss in Interconnect and Package Modelings. - Quan Chen 007; Hoi Wai Choi; Ngai Wong 001 (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2009)

Reduction of Thermal Resistance and Optical Power Loss Using Thin-Film Light-Emitting Diode (LED) Structure. - Huan-Ting Chen; Yuk Fai Cheung; Hoi Wai Choi; Siew-Chong Tan; S. Y. Hui 001 (IEEE Trans. Ind. Electron., 2015)

Intensity-Stabilized LEDs With Monolithically Integrated Photodetectors. - Kwai Hei Li; Haitao Lu; Wai Yuen Fu; Yuk Fai Cheung; Hoi Wai Choi (IEEE Trans. Ind. Electron., 2019)

InGaN RGB Light-Emitting Diodes With Monolithically Integrated Photodetectors for Stabilizing Color Chromaticity. - Kwai Hei Li; Yuk Fai Cheung; Weijian Jin; Wai Yuen Fu; Albert Ting Leung Lee; Siew-Chong Tan; Ron Shu-Yuen Hui; Hoi Wai Choi (IEEE Trans. Ind. Electron., 2020)

Heterogeneous Integration of Monolithic LED-PD With Circuitry for Intensity Stabilization. - Xiao Ma 018; Hao Lyu; Yuk Fai Cheung; Hoi Wai Choi (IEEE Trans. Ind. Electron., 2023)