Modified single cantilever adhesion test for EMC/PSR interface in thin semiconductor packages. - Kenny Mahan; Byung Kim; Bulong Wu; Bongtae Han; Ilho Kim; Hojeong Moon; Young Nam Hwang (Microelectron. Reliab., 2016)

Assembly yield prediction of plastically encapsulated packages with a large number of manufacturing variables by advanced approximate integration method. - Hsiu-Ping Wei; Bongtae Han; Byeng Dong Youn; Hyuk Shin; Ilho Kim; Hojeong Moon (Microelectron. Reliab., 2017)