Thermal modeling and design on smartphones with heat pipe cooling technique. - Hong-Wen Chiou; Yu-Min Lee; Hsuan-Hsuan Hsiao; Liang-Chia Cheng (ICCAD, 2017)

Phone-nomenon: a system-level thermal simulator for handheld devices. - Hong-Wen Chiou; Yu-Min Lee; Shin-Yu Shiau; Chi-Wen Pan; Tai-Yu Chen (ASP-DAC, 2019)

Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices. - Hsuan-Hsuan Hsiao; Hong-Wen Chiou; Yu-Min Lee (ASP-DAC, 2019)

Thermal Pad Design Flow for Automotive Electronics. - Guan-Jia Chen; Hong-Wen Chiou; Yu-Teng Chang; Yu-Min Lee (ICCE-TW, 2021)

Chiplet Placement for 2.5D IC with Sequence Pair Based Tree and Thermal Consideration. - Hong-Wen Chiou; Jia-Hao Jiang; Yu-Teng Chang; Yu-Min Lee; Chi-Wen Pan (ASP-DAC, 2023)

Phone-nomenon 2.0: A compact thermal model for smartphones. - Yu-Min Lee; Hong-Wen Chiou; Shin-Yu Shiau; Chi-Wen Pan; Shih-Ting Lin (IET Comput. Digit. Tech., 2023)