Ultra-Thin Chips on Foil for Flexible Electronics. - Horst Rempp; Joachim N. Burghartz; Christine Harendt; Nicoleta Pricopi; Marcus Pritschow; Christian Reuter 004; Harald Richter 001; Inge Schindler; Martin Zimmermann 004 (ISSCC, 2008)

Ultra-thin chips and related applications, a new paradigm in silicon technology. - Joachim N. Burghartz; Wolfgang Appel; Christine Harendt; Horst Rempp; Harald Richter 001; Martin Zimmermann 004 (ESSCIRC, 2009)

Manufacturing aspects of an ultra-thin chip technology. - Evangelos A. Angelopoulos; Muhammad S. Al-Shahed; Wolfgang Appel; Stefan Endler 002; Saleh Ferwana; Christine Harendt; Mahadi-Ul Hassan; Horst Rempp; Martin Zimmermann 004; Joachim N. Burghartz (ESSDERC, 2012)

Thermal characterization and modeling of ultra-thin silicon chips. - Muhammad Alshahed; Zili Yu; Horst Rempp; Harald Richter 001; Christine Harendt; Joachim N. Burghartz (ESSDERC, 2014)