Future on-chip interconnect metallization and electromigration. - Chao-Kun Hu; James J. Kelly; Huai Huang; Koichi Motoyama; Hosadurga Shobha; Yuri Ostrovski; James H.-C. Chen; Raghuveer Patlolla; Brown Peethala; Praneet Adusumilli; Terry A. Spooner; Roger Quon; et al. (IRPS, 2018)

Advanced BEOL Materials, Processes, and Integration to Reduce Line Resistance of Damascene Cu, Co, and Subtractive Ru Interconnects. - Takeshi Nogami; Oleg Gluschenkov; Yasir Sulehria; Son Nguyen; Brown Peethala; Huai Huang; Hosadurga Shobha; Nick A. Lanzillo; Raghuveer Patlolla; Devika Sil; Andrew Simon; Daniel Edelstein; et al. (VLSI Technology and Circuits, 2022)

Backside Power Distribution for Nanosheet Technologies Beyond 2nm. - Ruilong Xie; Wonhyuk Hong; Chen Zhang; Jongjin Lee; Kevin Brew; Richard Johnson; Nicholas A. Lanzillo; Hosadurga Shobha; Taesun Kim; Panjae Park; Shogo Mochizuki; Iqbal Saraf; et al. (VLSI Technology and Circuits, 2024)