Electromigration of multi-solder ball test structures. - Christine S. Hau-Riege; Huilin Xu; You-Wen Yau; Manasi S. Kakade; Jianfeng Li; Xiaonan Zhang; Hosain Farr (IRPS, 2018)

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)