Determination of the influence of stent strut thickness using the finite element method: implications for vascular injury and in-stent restenosis. - Houman Zahedmanesh; Caitríona Lally (Medical Biol. Eng. Comput., 2009)

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation. - Houman Zahedmanesh; Mario Gonzalez; Ivan Ciofi; Kristof Croes; Jürgen Bömmels; Zsolt Tökei (Microelectron. Reliab., 2016)

Stress mitigation of 3D-stacking/packaging induced stresses. - Kristof Croes; Vladimir Cherman; Melina Lofrano; Houman Zahedmanesh; Luka Kljucar; Mario Gonzalez; Ingrid De Wolf; Zsolt Tökei; Eric Beyne (IRPS, 2018)

Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects. - Sarath Mohanachandran Nair; Rajendra Bishnoi; Mehdi Baradaran Tahoori; Houman Zahedmanesh; Kristof Croes; Kevin Garello; Gouri Sankar Kar; Francky Catthoor (IRPS, 2019)

Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects. - Sarath Mohanachandran Nair; Rajendra Bishnoi; Mehdi B. Tahoori; Houman Zahedmanesh; Kristof Croes; Kevin Garello; Gouri Sankar Kar; Francky Catthoor (IRPS, 2020)

Electromigration limits of copper nano-interconnects. - Houman Zahedmanesh; Olalla Varela Pedreira; Zsolt Tokei; Kristof Croes (IRPS, 2021)

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Mustafa Badaroglu; Kristof Croes (SLIP, 2021)

Assessment of critical Co electromigration parameters. - O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; Philippe J. Roussel; Marleen H. van der Veen; Veerle Simons; Emmanuel Chery; Ivan Ciofi; Kris Croes (IRPS, 2022)

System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents. - Houman Zahedmanesh; Ivan Ciofi; Odysseas Zografos; Kristof Croes; Mustafa Badaroglu (IRPS, 2022)

Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM. - Mahta Mayahinia; Mehdi B. Tahoori; Manu Perumkunnil Komalan; Houman Zahedmanesh; Kristof Croes; Tommaso Marinelli; José Ignacio Gómez Pérez; Timon Evenblij; Gouri Sankar Kar; Francky Catthoor (IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022)

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters. - Youqi Ding; O. Varela Pedreira; Melina Lofrano; Houman Zahedmanesh; T. Chavez; Hosain Farr; Ingrid De Wolf; Kris Croes (IRPS, 2023)

Impact of via geometry and line extension on via-electromigration in nano-interconnects. - Ahmed Sobhi Saleh; Houman Zahedmanesh; Hajdin Ceric; Ingrid De Wolf; Kris Croes (IRPS, 2023)

A pragmatic network-aware paradigm for system-level electromigration predictions at scale. - Houman Zahedmanesh; Philippe Roussel; Ivan Ciofi; Kristof Croes (IRPS, 2023)

Challenges for Interconnect Reliability: From Element to System Level. - Olalla Varela Pedreira; Houman Zahedmanesh; Youqi Ding; Ivan Ciofi; Kristof Croes (ISPD, 2023)

De-Coupling Thermo-Migration from Electromigration Using a Dedicated Test Structure. - O. Varela Pedreira; Youqi Ding; D. Coenen; Philippe Roussel; Ahmed Sobhi Saleh; Veerle Simons; Houman Zahedmanesh; Ivan Ciofi; Kris Croes (IRPS, 2024)

Novel Concept-Oriented Synthetic Data approach for Training Generative AI-Driven Crystal Grain Analysis Using Diffusion Model. - Ahmed Sobhi Saleh; Kristof Croes; Hajdin Ceric; Ingrid De Wolf; Houman Zahedmanesh (CoRR, 2025)