Chip integration methodology for the IBM S/390 G5 and G6 custom microprocessors. - Robert M. Averill III; Keith G. Barkley; Michael A. Bowen; Peter J. Camporese; Allan H. Dansky; Robert F. Hatch; Dale E. Hoffman; Mark D. Mayo; Scott A. McCabe; Timothy G. McNamara; Thomas J. McPherson; Gregory A. Northrop; et al. (IBM J. Res. Dev., 1999)

MCM technology and design for the S/390 G5 system. - George A. Katopis; Wiren Dale Becker; Toufie R. Mazzawy; Howard H. Smith; Charles K. Vakirtzis; Scott A. Kuppinger; Bhupindra Singh; Phillip C. Lin; John Bartells Jr.; Gregory V. Kihlmire; Panangattur N. Venkatachalam; Herb I. Stoller; et al. (IBM J. Res. Dev., 1999)

R(f)L(f)C coupled noise evaluation of an S/390 microprocessor chip. - Howard H. Smith; Aline Deutsch; Sharad Mehrotra; David Widiger; Michael A. Bowen; Allan H. Dansky; Gerard V. Kopcsay; Byron Krauter (CICC, 2001)

On-chip wiring design challenges for gigahertz operation. - Alina Deutsch; Paul W. Coteus; Gerard V. Kopcsay; Howard H. Smith; Christopher W. Surovic; Byron Krauter; Daniel C. Edelstein; Phillip J. Restle (Proc. IEEE, 2001)

IBM eServer z900 high-frequency microprocessor technology, circuits, and design methodology. - Brian W. Curran; Yuen H. Chan; Philip T. Wu; Peter J. Camporese; Gregory A. Northrop; Robert F. Hatch; Lisa B. Lacey; James P. Eckhardt; David T. Hui; Howard H. Smith (IBM J. Res. Dev., 2002)

A comprehensive 2-D inductance modeling approach for VLSI interconnects: frequency-dependent extraction and compact circuit model synthesis. - Gerard V. Kopcsay; Byron Krauter; David Widiger; Alina Deutsch; Barry J. Rubin; Howard H. Smith (IEEE Trans. Very Large Scale Integr. Syst., 2002)

A CAD Methodology and Tool for the Characterization of Wide On-Chip Buses. - Ibrahim M. Elfadel; Alina Deutsch; Gerard V. Kopcsay; Bradley Rubin; Howard H. Smith (DATE, 2004)

IBM POWER6 microprocessor physical design and design methodology. - Rex Berridge; Robert M. Averill III; Arnold E. Barish; Michael A. Bowen; Peter J. Camporese; Jack DiLullo; Peter E. Dudley; Joachim Keinert; David W. Lewis; Robert D. Morel; Thomas E. Rosser; Nicole S. Schwartz; et al. (IBM J. Res. Dev., 2007)

Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies. - Chuan Xu; Lijun Jiang; Seshadri K. Kolluri; Barry J. Rubin; Alina Deutsch; Howard H. Smith; Kaustav Banerjee (ICCAD, 2009)

A 5.2GHz microprocessor chip for the IBM zEnterprise™ system. - James D. Warnock; Y. Chan; William V. Huott; Sean M. Carey; Michael F. Fee; Huajun Wen; Mary Jo Saccamango; Frank Malgioglio; Patrick J. Meaney; Donald W. Plass; Yuen H. Chan; Mark D. Mayo; et al. (ISSCC, 2011)

Circuit and Physical Design Implementation of the Microprocessor Chip for the zEnterprise System. - James D. Warnock; Yiu-Hing Chan; Sean M. Carey; Huajun Wen; Patrick J. Meaney; Guenter Gerwig; Howard H. Smith; Yuen H. Chan; John Davis; Paul Bunce; Antonio Pelella; Daniel Rodko; et al. (IEEE J. Solid State Circuits, 2012)

Circuit and Physical Design of the zEnterprise™ EC12 Microprocessor Chips and Multi-Chip Module. - James D. Warnock; Yuen H. Chan; Hubert Harrer; Sean M. Carey; Gerard Salem; Doug Malone; Ruchir Puri; Jeffrey A. Zitz; Adam Jatkowski; Gerald Strevig; Ayan Datta; Anne Gattiker; et al. (IEEE J. Solid State Circuits, 2014)

IBM z13 circuit design and methodology. - James D. Warnock; Christopher J. Berry; Michael H. Wood; Leon J. Sigal; Yun-Chan Myung; Guenter Mayer; Mark D. Mayo; Y. Chan; Frank Malgioglio; Gerald Strevig; Charudhattan Nagarajan; Sean M. Carey; et al. (IBM J. Res. Dev., 2015)