Evaluation of solder joint strengths under ball impact test. - Yi-Shao Lai; Hsiao-Chuan Chang; Chang-Lin Yeh (Microelectron. Reliab., 2007)

Empirical correlation between package-level ball impact test and board-level drop reliability. - Chang-Lin Yeh; Yi-Shao Lai; Hsiao-Chuan Chang; Tsan-Hsien Chen (Microelectron. Reliab., 2007)

Applying Situation Awareness Approach to Cooperative Play in Interactive Installation Storytelling System. - Wen-Hwa Cheng; Chich-Jen Shieh; Yung-Hoh Sheu; Hsiao-Chuan Chang (CDVE, 2010)