Interval optimal design of 3-D TSV stacked chips package reliability by using the genetic algorithm method. - Hsin-En Cheng; Rong-Sheng Chen (Microelectron. Reliab., 2014)

Packaging Parameters Analysis for the Fatigue Reliability of Stacked Chip Ball Grid Array by Using the Optimal Equivalent Solder Balls. - Hsin-En Cheng; Rong-Sheng Chen; Chao-Yang Mao (Qual. Reliab. Eng. Int., 2015)