Silicon Reliability Characterization of Intel's Foveros 3D Integration Technology for Logic-on-Logic Die Stacking. - Chetan Prasad; Sunny Chugh; Hannes Greve; I-chen Ho; Enamul Kabir; Cheyun Lin; Mahjabin Maksud; Steven R. Novak; Benjamin Orr; Keun Woo Park; Anthony Schmitz; Zhizheng Zhang 006; et al. (IRPS, 2020)