Optical Mold Cleaning Using Carbon Dioxide. - Jian-Shian Lin; Chieh-Lung Lai; Hsiu-Jen Lin; Ya-Chun Tu; Yoshimi Takeuchi (Int. J. Autom. Technol., 2010)

Interfacial microstructure and bonding strength of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.5Ce-xZn solder BGA packages with immersion Ag surface finish. - Hsiu-Jen Lin; Tung-Han Chuang (Microelectron. Reliab., 2011)