Thermal modeling and design on smartphones with heat pipe cooling technique. - Hong-Wen Chiou; Yu-Min Lee; Hsuan-Hsuan Hsiao; Liang-Chia Cheng (ICCAD, 2017)

Multi-angle bended heat pipe design using x-architecture routing with dynamic thermal weight on mobile devices. - Hsuan-Hsuan Hsiao; Hong-Wen Chiou; Yu-Min Lee (ASP-DAC, 2019)