Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology. - John U. Knickerbocker; Chirag S. Patel; Paul S. Andry; Cornelia K. Tsang; L. Paivikki Buchwalter; Edmund J. Sprogis; Hua Gan; Raymond R. Horton; Robert J. Polastre; Steven L. Wright; Christian D. Schuster; Christian W. Baks; et al. (CICC, 2005)

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias. - John U. Knickerbocker; Chirag S. Patel; Paul S. Andry; Cornelia K. Tsang; L. Paivikki Buchwalter; Edmund J. Sprogis; Hua Gan; Raymond R. Horton; Robert J. Polastre; Steven L. Wright; John M. Cotte (IEEE J. Solid State Circuits, 2006)

A LTCC microsystem vacuum package substrate with embedded cooling microchannel and Pirani gauge. - Min Miao; Jing Zhang; Yunsong Qiu; Yangfei Zhang; Yufeng Jin; Hua Gan (NEMS, 2010)

A novel LTCC capacitive accelerometer embedded in LTCC packaging substrate. - Hua Gan; Yufeng Jin; Min Miao; Xin Sun 003 (NEMS, 2011)