No-flow underfill flip chip assembly–an experimental and modeling analysis. - Hua Lu 003; K. C. Hung; Stoyan Stoyanov; Chris Bailey 001; Y. C. Chan (Microelectron. Reliab., 2002)

The effect of reflow process on the contact resistance and reliability of anisotropic conductive film interconnection for flip chip on flex applications. - Chunyan Yin; M. O. Alam; Yan Cheong Chan; Chris Bailey 001; Hua Lu 003 (Microelectron. Reliab., 2003)

Study of anisotropic conductive adhesive joint behavior under 3-point bending. - M. J. Rizvi; Y. C. Chan; Chris Bailey 001; Hua Lu 003 (Microelectron. Reliab., 2005)

Failure mechanisms of ACF joints under isothermal ageing. - M. J. Rizvi; Chris Bailey 001; Hua Lu 003 (Microelectron. J., 2008)

Design for reliability of power electronics modules. - Hua Lu 003; Chris Bailey 001; Chunyan Yin (Microelectron. Reliab., 2009)

A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. - E. Kamara; Hua Lu 003; Chris Bailey 001; Chris Hunt; Davide Di Maio; Owen Thomas (Microelectron. Reliab., 2010)

Integration of analytical techniques in stochastic optimization of microsystem reliability. - Xiangdong Xue; Chris Bailey 001; Hua Lu 003; Stoyan Stoyanov (Microelectron. Reliab., 2011)

False shares in verifiable secret sharing with finite field commitments. - Hua Lu 003; Jack Peterson (CoRR, 2015)

Sintered silver finite element modelling and reliability based design optimisation in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

A time dependent damage indicator model for Sn3.5Ag solder layer in power electronic module. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001 (Microelectron. Reliab., 2015)

Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. - Pushparajah Rajaguru; Hua Lu 003; Chris Bailey 001; Jose Angel Ortiz Gonzalez; Olayiwola Alatise (Microelectron. Reliab., 2017)

An analysis of the reliability and design optimization of aluminium ribbon bonds in power electronics modules using computer simulation method. - Kenneth Chimezie Nwanoro; Hua Lu 003; Chunyan Yin; Chris Bailey 001 (Microelectron. Reliab., 2018)