Wafer-level 3D integration using hybrid bonding. - Cheng-Ta Ko; Kuan-Neng Chen; Wei-Chung Lo; Chuan-An Cheng; Wen-Chun Huang; Zhi-Cheng Hsiao; Huan-Chun Fu; Yu-Hua Chen (3DIC, 2010)

Performance and process characteristic of glass interposer with through-glass-via(TGV). - Chun-Hsien Chien; Hsun Yu; Ching-Kuan Lee; Yu-Min Lin; Ren-Shin Cheng; Chau-Jie Zhan; Peng-Shu Chen; Chang-Chih Liu; Chao-Kai Hsu; Hsiang-Hung Chang; Huan-Chun Fu; Yuan-Chang Lee; et al. (3DIC, 2013)