Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology. - Hyun-Chul Sagong; Hyunjin Kim; Seungjin Choo; Sungyoung Yoon; Hyewon Shim; Sangsu Ha; Tae-Young Jeong; Minhyeok Choe; Junekyun Park; Sangchul Shin; Sangwoo Pae (IRPS, 2018)

Investigation of BTI characteristics and its behavior on 10 nm SRAM with high-k/metal gate FinFET technology having multi-VT gate stack. - Minjung Jin; Kangjung Kim; Yoohwan Kim; Hyewon Shim; Jinju Kim; Gunrae Kim; Sangwoo Pae (Microelectron. Reliab., 2018)

Aging-Aware Design Verification Methods Under Real Product Operating Conditions. - Hyewon Shim; Jeongmin Jo; Yoohwan Kim; Bongyong Jeong; Minji Shon; Hai Jiang 005; Sangwoo Pae (IRPS, 2019)

Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology. - Hai Jiang 005; Hyun-Chul Sagong; Jinju Kim; Hyewon Shim; Yoohwan Kim; Junekyun Park; Taiki Uemura; Yongsung Ji; Taeyoung Jeong; Dongkyun Kwon; Hwasung Rhee; Sangwoo Pae; et al. (IRPS, 2020)

Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction. - Hai Jiang 005; Jinju Kim; Kihyun Choi; Hyewon Shim; Hyunchul Sagong; Junekyun Park; Hwasung Rhee; Euncheol Lee (IRPS, 2021)

Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology. - Taiki Uemura; Byungjin Chung; Jegon Kim; Hyewon Shim; Shin-Young Chung; Brandon Lee; Jaehee Choi; Shota Ohnishi; Ken Machida (IRPS, 2022)

Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices. - Taiki Uemura; Byungjin Chung; Jegon Kim; Hyewon Shim; Shin-Young Chung; Brandon Lee; Jaehee Choi; Shota Ohnishi; Ken Machida (IRPS, 2022)

Reliability Assessment of 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FETs. - Seongkyung Kim; Hyerim Park; Eunyu Choi; Young Han Kim; Dahyub Kim; Hyewon Shim; Shin-Young Chung; Paul Jung (IRPS, 2023)

Impact of Barrier Metal Thickness on SRAM Reliability. - Rakesh Ranjan; Pavitra Ramadevi Perepa; Ki-Don Lee; Hokyung Park; Peter Kim; Ganesh Chakravarthy Yerubandi; Jon Haefner; Caleb Dongkyun Kwon; Minjung Jin; Wenhao Zhou; Hyewon Shim; Shin-Young Chung (IRPS, 2023)

Polarity Dependency of MOL-TDDB in FinFET. - Manisha Sharma; Hokyung Park; Yinghong Zhao; Ki-Don Lee; Liangshan Chen; Joonah Yoon; Rakesh Ranjan; Caleb Dongkyan Kwon; Hyewon Shim; Myungsoo Yeo; Shin-Young Chung; Jon Haefner (IRPS, 2023)

An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology. - Sangmin Oh; Taeyoung Jeong; Junghwan Yum; Minhyuk Lim; Yoohwan Kim; Bongyong Jeong; Jeongmin Jo; Hyewon Shim; Shin-Young Chung; Paul Jung (IRPS, 2024)

A Systematic Study of HCI Improvement in FinFET with Source/Drain Implant and Geometry Modulation. - Rakesh Ranjan; Pavitra R. Perepa; Ki-Don Lee; Ashish Kumar Jha 005; Kartika Chandra Sahoo; Kayla N. Sanders; Robert Moeller; Prateek Sharma; Minhyo Kang; Peter Kim; Kwanjae Song; Yongwoo Jeon; et al. (IRPS, 2024)

Hot-Carrier-Degradation Characterization for Accurate End-of-Life Prediction with 3nm GAA Logic Technology Featuring Multi-Bridge-Channel FET. - Seongkyung Kim; Junkyo Jeong; Eunyu Choi; Jinyoung Kim; Hyewon Shim; Shin-Young Chung; Paul Jung (VLSI Technology and Circuits, 2024)