A study on wafer level TSV build-up integration method. - Jae Hak Lee; Hyoung Joon Kim; Jun-Yeob Song; Chang Woo Lee; Tae Ho Ha (3DIC, 2013)

High reliability insert-bump bonding process for 3D integration. - Jun-Yeob Song; Jae Hak Lee; Hyoung Joon Kim; Chang Woo Lee; Tae Ho Ha (3DIC, 2013)