Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications - Jeong-Won Yoon; Hyun-Suk Chun; Ja-Myeong Koo; Seung-Boo Jung (CoRR, 2007)

Mechanical reliability of Sn-rich Au-Sn/Ni flip chip solder joints fabricated by sequential electroplating method. - Jeong-Won Yoon; Hyun-Suk Chun; Bo-In Noh; Ja-Myeong Koo; Jong-Woong Kim; Hoo-Jeong Lee; Seung-Boo Jung (Microelectron. Reliab., 2008)