Evaluating the material properties of underfill for a reliable 3D TSV integration package using numerical analysis. - Hyungseok Yoon; Kwang-Seong Choi; Hyun-Cheol Bae; Jong-Tae Moon; Yong-Sung Eom; Insu Jeon (Microelectron. Reliab., 2017)

Development of a Robot Arm Link System Embedded with a Three-Axis Sensor with a Simple Structure Capable of Excellent External Collision Detection. - Alchan Yun; Woosub Lee; Soonkyum Kim; Jong-Ho Kim; Hyungseok Yoon (Sensors, 2022)